Abstract
UV-LIGA technics which used in high aspect ratio micro-structure fabrication has been developed quickly currently, but there still exist many technical problems which may affect the reliability of production, especially in lithography and electroform process. According to analyzing the technical process of bi-layer micro-gear, the reliability problems have been studied from two aspects, including deep lithography and micro electroform. In the deep lithography technology, the adhesive property between SU-8 photoresist and substrate and the non-uniform thickness and bubble problems of SU-8 photoresist layer have been presented. In the micro electroform aspect, problems include non-uniformity, air holes, and adhesive property of electroformed layer. Aimed at these problems, the resolvents have been put forward and validated, which improve the reliability of technics and possess fine effect.
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