Abstract

Ceramic array armor suffers from insufficient constrained capability of ceramic units in the embedded armor structure, leading to weak interfacial bonding at ceramic unit connections, significantly reducing the overall ballistic performance. In this study, centimeter-sized SiC hexagonal prisms and micrometer-sized B4C powders were used as reinforcing materials. A high-strength, high-toughness, and multiscale array (SiCh-p + B4Cp)/5083Al armor with strong interfacial bonding was prepared using pressure infiltration technique. The (SiCh-p + B4Cp)/5083Al armor was combined with ultra-high molecular weight polyethylene and 6252 armor steel to form an integrated armor system. To investigate the effect of constrained material on its ballistic performance, the array structures with epoxy and 5083Al as constrained material were prepared for comparison. Ballistic performance tests were conducted using 12.7 mm Armor-Piercing Incendiary (API). The damage mechanisms of the armor structure were studied through finite element simulation and a combination of macroscopic and microscopic analyses. The results demonstrate excellent overall ballistic performance of the (SiCh-p + B4Cp)/5083Al armor system. The high-strength and high-toughness 55 vol%B4Cp/5083Al composite material exhibits strong interfacial bonding with SiCh-p, providing robust support to the SiCh-p. The armor back deformation was reduced by 50 %, and the ceramic layer dissipated more than 70 % of projectile kinetic energy, The materials prepared in this study exhibit significant potential in ballistic performance.

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