Abstract
This paper presents a new design scheme of microchannel cold plate for the heat dissipation of airborne high heat flux electronic equipment. In this scheme, the flow path of the cold plate is composed of a contraction channel and an expansion channel alternately arranged. The performance of cold plate is simulated by computational fluid dynamics method. The results show that the convective heat transfer performance in the contraction channel is better than that in the expansion channel, but the flow resistance is significantly higher than that in the latter channel. During the actual operation, the cold plate will distribute the flow according to the characteristics of the flow resistance, and the larger share of the flow will be obtained in the expansion channel. This flow distribution mechanism keeps the total heat transfer of the two channels at a close level, and effectively stops the large increase of flow resistance.
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