Study on the mechanism affecting the quality of micro-hole in ultrasonic-assisted drilling of high-speed circuit boards

Abstract

High-speed circuit boards are created to meet the high-speed signal transmission requirements of 5G communication technology, but the non-polar resins, flat glass fibers, and multiple and hard fillers used for this purpose have posed new challenges to their micro-hole processing. The quality of micro-hole has always been a decisive factor in board performance. Therefore, this paper aims at proposing a new processing method for improving the micro-hole drilling quality of high-speed circuit boards. By establishing an ultrasonic-assisted drilling tool motion model, analyzing the changes in drilling method, material deformation, chip breakage, and chip removal during ultrasonic-assisted drilling of printed circuit boards, the influence mechanism on micro-hole quality during ultrasound-assisted drilling is studied prudently. Besides, an experimental platform for ultrasonic-assisted drilling is designed and built, and single-factor experiments for verification of ultrasonic effects, optimization of drilling parameters, and orthogonal experiments for ultrasonic-assisted drilling of high-speed circuit boards are conducted on this platform. The experimental results show that the loading of ultrasonic vibration has made an obvious improvement on several machining defects including hole wall roughness, entrance burr, and nail head in micro-hole drilling of high-speed circuit boards. In addition, the influence order of each processing parameter and a better combination of them are discovered, which provides a theoretical research basis and instructions for the improvement of micro-hole quality of high-speed circuit boards.