Abstract
ELID for SiC which enables the improvement of surface quality is put forward. ELID grinding technology is new technology of ultra-precision grinding, and the oxide film is formed on grinding wheel by electrolytic in-process technology, thus the wheel is in-process dressed. SiC material removal mechanism and ELID grinding mechanism is analyzed, the character and condition of brittle to ductile transition of SiC and surface formation mechanism of ductile mode grinding of SiC are studied, the results show that ELID grinding can realize ductile grinding ,this will lower the surface damage and improve the machining efficiency.
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