Abstract
In order to remove defect and enhance quality of flip-chip bonding, the influence of multiparameter in dipping process is researched. A dipping experimental bed is established, and images of dipping process is recorded by high-speed camera, the relationships between dipping glue quantity and dipping parameters including dipping speed, dipping depth, dipping time and viscosity of flux are discussed. In dipping process, a phenomenon that flux gathers into a mass was observed, and it is the main reason why there is a corrosion phenomenon. And dipping results show a decreasing trend of glue quantity as dipping speed increases, an increasing trend of glue quantity as dipping depth increases and an increasing trend of glue quantity as dipping time increases. The influence of viscosity is divided into two stages, it shows an increasing trend as viscosity increases when viscosity is smaller than 8PaS, and it is a decreasing trend as viscosity increases when viscosity is larger than 8PaS.
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