Abstract
The thermal stability of organic light‐emitting diodes (OLEDs) has attracted great attention with their application in display areas. In this article, the expansion of films under heat shock is studied. With the increase of annealing temperature, the contact between the organic and inorganic layers becomes inferior. Doping the host material uniformly in the adjacent light‐emitting layer is proposed to improve the stability of OLEDs under thermal shock. The results show that the optimized device still maintains a stable optoelectrical performance after thermal shock at 85 °C.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
