Abstract
Vapor phase soldering (VPS) is used in the assembly of highly reliable electronic products for aerospace, military, and industrial area for the advantages of heat transfer coefficient, good temperature uniformity, and controllable maximum soldering temperature. VPS is usually used for PCB (Printed Circuit Board) and complex components. However, little research has been done on the application of VPS process technology on the SiP (System in Package) component in the process of solder ball or solder column package. In this work, we investigated the influence of the vacuum VPS process on the SiP component. The advantages of VPS and vacuum process were discussed and the maximum shear strength of solder joints in the vacuum process was calculated. The vacuum process has no impact on the internal structure of the SiP component.
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