Abstract

In order to improve the heat transfer performance of the manifold microchannel, a cylindrical pin-fin manifold microchannel heat sink is designed on the basis of the manifold microchannel. The flow and heat transfer characteristics of the heat sink are numerically investigated. The results show that the heat transfer performance of the pin-fin manifold microchannel is better than that of the rectangular manifold microchannel at the same mass flux, but the pressure drop of the pin-fin manifold microchannel is higher. The heat transfer performance of the pin-fin manifold microchannel is better than that of the rectangular manifold microchannel at the same pressure drop, and the mass flux of the pin-fin manifold microchannel is less. The arrangement of pin fins is optimized in the ratio of the transverse length to the longitudinal length between 0.49 and 1.34 at the same pressure drop. The local optimal ratio is in the range of 0.8 to 0.9. The flow and heat transfer characteristics of the pin-fin manifold microchannel in subcooled flow boiling are numerically studied. The results show that the average chip temperature of the pin-fin manifold microchannel still fluctuates after the overall trend is stable.

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