Abstract
Conductive anodic filament (CAF) formation, a failure mode in printed circuit boards (PCBs), which has been reported in 1976, has caused catastrophic field failures on electronic product. With the trend of high circuit density demands in organic packages, the pitch of plated through holes (PTHs) in packages should be reduced, and the amount of CAF failures is expected to be significantly higher. The mechanism for CAF is the transfer of copper (Cu) ions and the deposition of Cu salts along the epoxy-glass interface in the presence of moisture and voltage bias influenced by concentration and pH gradients, from anode to cathode. Recently, following the increase of CAF failure in electronic assembles, CAF reliability concerns in the industry have increased as board designs have advanced in terms of decreasing dimensions and/or higher voltages.
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