Study on the Fabrication Process and Reliability Performance of Contactless Smart Card Using Nonconductive Film

Abstract

Contactless smart cards are widely used in various applications, such as access control, transit fare payment systems, etc. In order to improve the performance and at the same time to reduce the production cost, research work on the application of new materials and the development of new processes never stops. In this study, the assembly process of contactless smart card using nonconductive adhesive film (NCF) was investigated and adjusted considering the poor performance of PET substrate used in the test in terms of its heat resistance. Pressure cooker test was then performed to further evaluate reliability performances of the card assemblies after being subjected to severe temperature and humidity conditions. The smart card assemblies underwent both mechanical and electrical characterizations during the assembly process and the reliability test. Examinations on surface morphologies and cross-sections by SEM and optical microscope were conducted to understand the failure mechanisms.