Study on the effect of the interlayer on the adhesion of 400 μm thick film

Abstract

We have studied on the effect of the interlayers on the adhesion of 400 μm thick NiTiN gradient films. In order to improve the adhesion of the NiTiN films, the interlayer films are formed at the interfaces between the thick films and tungsten carbide substrates (WC-Co). The interlayers have the SiNi multilayer structures and are prepared by ion beam and vapor deposition (IVD) method. The Si interlayers are prepared at various internal stresses on tungsten carbide substrates and the Ni interlayers also are prepared at various internal stresses on the Si interlayers. The 400 μm thick films are formed by cathodic are ion-plating method on the SiNi interlayers. As a result, it seems that it is possible to improve the adhesion of the thick films by decreasing internal stress mismatch among the lower layers of the thick films, upper layers of interlayers and lower layers of interlayers.