Study on the Effect of Release Agent on the Surface Flashover of Plasma Modified Epoxy Resin

Abstract

Micron alumina epoxy resin is easy to accumulate a large number of charges under a DC electric field, which leads to flashover along the surface and threatens the operation of the power system. In the paper, we used four common release agents to prepare micron alumina epoxy resin samples, and modified the surface of each sample by plasma technology. We explored the effect of release agent on the physicochemical properties of plasma modified epoxy resin by SEM and XPS. Finally, we tested the flashover voltage, charge dissipation rate, and trap distribution, and analyzed the influence of release agent and plasma etching on the electrical properties of epoxy resin. The results show that the four release agents have different effects on the flashover voltage of epoxy resin; Plasma etching introduces the physical traps and chemical shallow traps, and increases the charge dissipation rate of epoxy resin. The flashover voltage of epoxy resin increases first and then decreases with etching time of plasma. The various test methods and test results used in this paper will help to reveal the intrinsic connection between the gas-solid interface properties of epoxy materials and DC flashover, and provide a possible scheme to improve the DC flashover performance of insulating materials.