Abstract
Adhesion strength is of great importance for silver paste of heterojunction solar cells (HJT silver paste). It has a close relation with the curing system, as well as the curing process or curing conditions of the paste. The interactions among all the curing conditions such as curing time (t, min), treatment temperature (T, °C), and curing agent dosage (m, wt%) are obviously complex and hard to analyze. Response surface methodology (RSM) is used to research the interactions among t, T, and m and to optimize the curing process. The results of this study indicate that an increase of curing time and treatment temperature both had a positive effect on adhesion strength. The effect of curing time is more obvious under a lower treatment temperature. 41 wt%, 199 °C, and 44 min were determined as the optimum process conditions. The quadratic model predictions fitted well with the experimental data with a deviation less than 3%. The FTIR results indicated that there were both addition and esterification processes in the reaction of E51 and ring-open MeTHPA. Scanning electron microscopy (SEM) images showed that the silver paste formed a dense interconnected network and provided a continuous pathway for current carrier transmission. This research demonstrated the effectiveness of the E51-MeTHPA system for HJT silver paste and the superiority of RSM in studying the curing process of silver paste.
Highlights
The photovoltaic industry has experienced rapid development for several decades, owing to its environmental friendliness and renewability [1,2,3,4,5]
The silver paste cured at low temperature should be used as the metal electrodes for the HJT solar cell, which is very different from traditional silver paste of crystalline silicon solar cells sintered at a higher temperature of about 800 ◦ C
It is obvious that the effects of curing conditions and the curing mechanism are of great significance to HJT silver paste to improve the adhesion strength
Summary
The photovoltaic industry has experienced rapid development for several decades, owing to its environmental friendliness and renewability [1,2,3,4,5]. Adhesion strength is one of the primary parameters of silver paste It is an important symbol of soldering reliability, which affects the electrical performance and service life of the solar cell module. It is obvious that the effects of curing conditions and the curing mechanism are of great significance to HJT silver paste to improve the adhesion strength. Most of the experimental results concerning various curing systems were obtained with a single-factor method [19,20,21] In this way, the interactions among those processing conditions are difficult to analyze. RSM shows the potential to analyze the interactions among the operation conditions as well as to determine the dynamic effect of all the factors on the mechanical property of the HJT silver paste. Curing mechanism analysis and validation experiments were carried out in this study
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