Study on the continuous quality improvement systems in semiconductor assembly

Abstract

Compared with other manufacturing processes, the process of semiconductor assembly has several particular characteristics: highly automated manufacturing processes, high manufacturing speed and multivariate critical quality characteristics. Based on the requirements of continuous quality improvement in semiconductor assembly processes, a method of material quality tracking and controlling with SPC chart was put forward. With this method, the sampling program can be adjusted according to the quality record of a supplier. And then a framework of 3-layer SPC was put forward. In this framework, the CTQ, qualification rate of processes, and qualification rate of final products can be controlled by proper SPC chart in different layer and this method is helpful to avoid unqualified products effectively. Furthermore, a model of quality improvement in semiconductor assembly with SPC and data mining was studied. This model can be used for improving the ability of process diagnosing and shortening the diagnosing time. At last, a structure of an integrated quality information system for semiconductor assembly was put forward. The result of this paper may be helpful for the continuous quality improvement in semiconductor assembly processes and it can also be used in other similar processes.