Abstract
Microscale laser shock peening (μLSP) is a novel surface treating technology which oriented to microscale metal components in MEMS. Beneficial compressive residual stress is induced at the shocked region to improve the performance of microstructure based on wave-solid interactions. In this paper, the basic principle of μLSP and mechanism of wave-solid coupling were introduced, the influence factors on strengthening effects, such as micro-size effect, anisotropy, dislocation, stacking fault, grain boundary and surface energy were discussed from the microscopic point of view, the results provide theoretical guidance for further study.
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