Abstract
A heat transfer model and a cellular Automation-Finite Element (CAFE) coupling model were established to analyze the solid/liquid (S/L) interface and solidification structure evolution of high purity copper Direct-chill (DC) casting billet under different casting conditions. The simulation and actual experimental results of liquid sump shape and solidification structure were first compared to verify the accuracy of the model. It is proved that the model is effective for simulating the solidification structure of the actual DC casting high purity copper billet. After that, the model was used to predict the solidification structure under different casting temperatures, casting speeds, and heat transfer coefficients. It is shown that, with the increase of casting temperature, the grain size decreases first and then increases. There is a compromise between grain size and its uniformity, and the grain size is more uniform at higher casting temperature. With the increase of casting speed, the depth of liquid sump and the height of the S/L interface increase, but the total grain number of the billet cross-section decreases gradually. As the heat transfer coefficient increases, the depth of the casting liquid sump becomes shallow, but the height of the solid-liquid interface increases and the grain size increases gradually. For the preparation of high purity copper billets with large cross-sectional dimensions by DC casting, a fine solidified structure could be obtained by appropriately reducing the casting speed and cooling intensity.
Highlights
The high purity copper target can meet the nano-level wiring requirements of integrated circuits due to its advantages of low resistivity, good conductivity, high electromigration resistance, and excellent heat dissipation [1,2]
The accuracies the heat transfer model and CAFEmodel model were verified according to the actual production process, casting parameters, and experimental results
The accuracies of the heat transfer model and were verified according of to the the heat transfer model was performed by a comparison of the simulated liquid sump shape and the actual production process, casting parameters, of and experimental results.sump
Summary
The high purity copper target can meet the nano-level wiring requirements of integrated circuits due to its advantages of low resistivity, good conductivity, high electromigration resistance, and excellent heat dissipation [1,2] It is one of the most commonly used metal target products in the electronics industry. Aimed to systematically reveal the effect of casting parameters on heat transfer the varying boundary behavior and solidification structure of high purity billet. DCpurity castingcopper was established, including the industrial DC casting system and production process of high billets, a comprehensive macro heat transfer model and solidification model. The accuracy of the model was validated mathematical model of high purity copper DC casting was established, including the macrobased heat on the experimental results.
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