Abstract
Ti2SnC modified copper-graphite composites were fabricated by spark plasma sintering (SPS) and gas pressure sintering with 40 wt% Cu, 10 wt% graphite, and 50 wt% Ti2SnC as components. The phase composition, microstructure, and relative density of the composites were analyzed in detail. The results show that Sn atoms diffuse out from Ti2SnC and into the copper matrix in the composite sample and those fabricated by SPS are stronger than that of gas pressure sintering. The bonding of copper and graphite is favorable, but the pores created by the agglomeration of Ti2SnC grains are difficult to eliminate by using SPS to fabricate the composites. In contrast, air pressure sintering is beneficial for eliminating the pores caused by the agglomeration of Ti2SnC grains, but perfect mechanical interlocking between copper and graphite is lacking.
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