Study on rigid restraint thermal self-compressing bonding – A new solid state bonding method

Abstract

A new solid state bonding method without the use of external force named as rigid restraint thermal self-compressing bonding is proposed in this study. The fundamental principle is locally heating the zones near the butted surfaces of the rigid restrained plates to produce a thermal elastic–plastic stress–strain field which compresses the zones to be bonded, facilitates the atomic diffusion of butted surface and then produces perpetual joint. Experiments were conducted on Ti6Al4V plates to show the feasibility of rigid restraint thermal self-compressing bonding using electron beam as heat source. Results showed that solid state joint with high bonding rate was attained. Microstructure and microhardness distribution for the joint were homogeneous. The tensile strength, yield strength and elongation of the joint were comparable to that of the base metal. High quality joint was attained without deterioration in the mechanical properties.