Abstract
Polycrystalline diamond wafers valued for their unique optical properties and thermal conductivity, are optimal for high-technologies applications like optical windows and thermal spreaders. They require a very smooth surface finish, demanding to reach nanometer-level roughness. Their hardness and corrosion resistance, however, make surface grain removal difficult, and large grains can cause stress concentration, which can result in cracking. Traditional CMP faces limitations due to slow oxidizer reactivity and contamination risks. This study exploits the reaction between transition metals and diamond wafers to improve removal rates and grain elimination. Adding Fe, Ti, and Ni reactive abrasives in resin diamond wheels, material removal rate by weighing the weight change and surface roughness was measured using a ZYGO 3D profiler. Fe notably increased removal efficiency and surface quality, indicating that transition metals enhance the transformation of surface grains into amorphous carbon for superior processing.
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