Abstract
Diamond/copper composites are regarded as a new generation of heat dissipation materials because of their good thermal conductivity and matched thermal expansion coefficient to semiconductor materials. This study focuses on the thermal application study of the diamond/copper composite. A diamond/copper composite cooling module was designed to meet the requirements of thermal physical properties of an electronic device. The heat conduction resistance of diamond/copper substrate was calculated theoretically. It is found that the optimum thickness of diamond/copper substrate is about 0.34 times of the equivalent radius and improving the thermal conductivity of the substrate is more effective for heat dissipation when the thermal convective resistance is low. When the heat flux of the chip is 100 W/cm2, the temperature of the chip using diamond/copper composite as substrate is 4.84 °C lower than that using silicon aluminum alloy. The improvement effect increases about 5 °C when the heat flux increases by 100 W/cm2.
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