Study on properties of high reinforcement-content aluminum matrix composite for electronic packages

Abstract

High reinforcement-content aluminum matrix composite, with a high thermal conductivity, the adjustable coefficient of thermal expansion, low density and costs, have been extensively applied in electronic package. The Sip/Al composites were fabricated by squeeze casting technology. The microstructure observation showed that the composites were dense and macroscopically homogeneous, with no micro-holes and obvious defects. The linear CTEs of Sip/Al composites lay between 7.6-8.1/spl times//sup 10-6// /spl deg/C, and the thermal conductivity was larger than 100 W/ (m/spl deg/C). The composites also had lower density (2.4 g/cm/sup 3/), higher special strength and special modulus. The electroless nickel method was used to deposit a continuous and uniform layer on the composites surface, which can meet the reliability testing demands of the diodes with Sip/Al composite baseplate.