Abstract

In this paper, we investigate a metal composite prepared using a one-step pressing method, where Al–Si alloy acts as the phase change materials (PCMs) and Al2O3/AlN serve as the structural support materials. The alloy formation and PCM composite preparation are synthesized in a single step. The study aims to characterize the microstructure, thermodynamic, and thermal properties of the composite material. To assess the heat storage properties of the prepared composite PCMs at temperatures higher than 600 °C, a high-temperature test system is established using a high-frequency induction heater. Additionally, we explore how to improve the issue of liquid leakage under high-temperature conditions. The results demonstrate that Al2O3 and AlN (ceramic materials) exhibit excellent chemical compatibility with Al–Si composite PCMs. After sintering, the ceramic materials form a strong bond with Al–Si, effectively retaining the liquid phase of Al–Si alloy within the composite material. Consequently, the Al–Si composite PCMs do not exhibit high-temperature liquid leakage under elevated conditions. Both Al2O3/Al–Si and AlN/Al–Si composites possess favorable high temperature heat storage properties. The phase change enthalpy of Al2O3/Al–Si composite reaches 400 kJ/kg, with a thermal conductivity of 36 W/(m·K). Similarly, the AlN/Al–Si composite achieves a phase change enthalpy of 404 kJ/kg and a thermal conductivity of 43 W/(m·K). Both composites fulfill the requirements for high-temperature heat storage applications.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.