Abstract
LEDs have the advantages of high efficiency, low power consumption, environmental friendliness and long life. Nowadays with brightness of LEDs increasing rapidly, it has various applications such as street light, flat panel backlighting, vehicle forward lamp and general illumination. The increasing demand for light emitting diodes (LEDs) has been absorbed by a number of application fields, including display backlighting, communications, medical services, signage, and general illumination. When high power LEDs are applied under complex service conditions, especially encounter thermal fluctuations and off and on duty cycles, the cyclical strain and stress are imposed upon its chip, which eventually leads to chip failure. In particular, with the trend that LEDs are expected to service in more dynamic environments where the temperature distribution change with time, not only the luminous flux and thermal resistance but also the fatigue resistance of the chip become of great significance for reliability.
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