Study on optimization of thermal property parameters of phase change wallboard and its application simulation in the building

Abstract

In this paper, a parameter-based design approach for phase change wallboard is presented. Based on existing gypsum composite phase change materials, COMSOL simulation software was used to understand the influence of parameters including phase change temperature, wallboard thickness, thermal conductivity, and latent heat value on the thermal performance of phase change wallboard and analyze different indoor environments and energy-saving efficiency of various parameter schemes in practical application. The effect of those parameters for phase change wallboard that used in outer envelopes and inner partitions is also compared to determine an optimized scheme for phase change wallboard applied in the city of Xi'an. The results demonstrate the most important element that affects the inner surface temperature is the thickness of the phase change wallboard, then the phase change temperature, and last thermal conductivity. Using integrated PCM on the envelope is not only beneficial to adjust the indoor thermal environment and reduce energy consumption, but also help to achieve the best cooling and energy conservation effects by optimizing material parameters in practice. The phase transition temperature of PCM applied in walls should approach mean temperature. Furthermore, exterior walls need PCW with larger thickness and smaller thermal conductivity, and interior walls equip PCW with higher thermal conductivity and latent heat. The optimized scheme can reduce the average room maximum temperature by 1.24 °C and the cooling load by 953 W per square meter.