Study on nano silicon carbide water-based cutting fluid in polysilicon cutting

Abstract

Diamond wire sawing technology is widely used in polysilicon cutting. The poor lubrication performance of the common water-based cutting fluid results in many cutting grooves and kerfs on wafer surface, which increases the difficulty of subsequent processing. In this paper, the application of nanoparticles water-based cutting fluid in polysilicon diamond wire sawing was proposed to further improve surface quality of wafers. A novel water-based cutting fluid was prepared with nano silicon carbide (N–SiC), polyethylene glycol (PEG2000) and sodium carboxymethylcellulose (CMC-Na). The dispersibility and friction performance of N–SiC cutting fluid were studied. And then the cutting performance of cutting fluid with different N–SiC content was investigated. Research results show that the dispersibility and friction performance of cutting fluid with 0.2 wt% N–SiC, 0.5 wt% CMC-Na and 6 wt% PEG2000 are the best. N–SiC particles can effectively reduce the width of edge breakage and the surface roughness of polysilicon wafers. The width of edge breakage and the surface roughness reach the lowest value when the N–SiC content in the cutting fluid is 0.2 wt%.