Abstract
Adding nano montmorillonite and polyethylene glycol to modify phenolic resin in interlayer polymerization process to improve the heat resistance and toughness of the foam material. And the affect of phenolic ratio on the microstructure of phenolic foam was studied .Then the structure of modified phenolic resin was analyzed by the XRD tester, infrared spectroscopy and SEM. The results showed that polyethylene glycol and phenolic resin occured a strong interaction to forme the composite material, which enhanced the modified phenolic resin foam material toughness. Montmorillonite improved the heat resistance by increased distance between the phenolic resin layer to make the thermal decomposition temperature becoming 361 ˚C. The greater the ratio of phenolic resin is, the lower reactivity of acid curing and the smaller diameter of bubbles forming will be.
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