Abstract
High strength elastic alloy has an important role in the manufacture of electrical equipment and machine building. Along with the development of information and telecommunications technology, the application of this alloy in electrical and electronic equipment is very increasingly. Even on boards or connectors of common electrical equipment such as computers, cell phones, these connectors are usually made of high strength elastic copper alloy. The design required features are small, precision built, with high mechanical strength and elasticity, heat resistance, abrasion and corrosion resistance in the operating environment to ensure its/the power and signal stability for a long time. The design trend is reduced in size but still assure the equipment quality is growing significantly and the corporation to manufacture equipment is researched thoroughly. Accordingly, this article presents the research results about the alloy copper with 9%Ni and 6%Sn which has the high elastic strength and elasticity properties of elastomers after heat treatment. The properties of the microstructure, hardness, conductivity, dry friction coefficient, the corrosion resistance of the alloy from which to determine the parameters for the materials selection procedure and the design of the manufacturing of magnetic contact of this alloy. The results of the study show that after heat treatment and deformation, the Cu-9Ni-6Sn has a strength of alloy up to 1200MPa, the elastic limit is 1100MPa and the conductivity is 8.4%IACS, respectively. The values of this characteristic are consistent with the working conditions of the electrical contact. With the deformation process combined with the heat treatment process, the results of our research group created a single-phase homogeneous microstructure that is chemically stable with the spinodal decomposition in appropriate to the treatment of aging process. By modern methods, this paper demonstrates the durability of the alloy due to the spinodal decomposition during aging treatment at 350°C. This structure of spinodal decomposition is about 20-40nm in size, dispersed throughout the entire cross-section of the sample.
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