Study on mechanical properties of ZnO/Si interface under thermal shock

Abstract

Influence of thermal shock on ZnO/Si interfacial mechanical properties was studied through experiments, molecular dynamics simulations and machine learning prediction. ZnO films were deposited onto silicon wafers by radio frequency magnetron sputtering and then suffered different times of thermal shock. The experimental results show the adhesion strength of ZnO/Si interface is relatively stable under thermal shock. XRD and simulation illustrate the interfacial reactions of Si based films could experience strong interaction through Si, Zn and O atoms located at ZnO/Si interface during thermal shock, which could explain the stability of the interface. The machine learning indicates the mechanical properties of ZnO/Si interface are still relatively stable after more thermal shocks. The obtained conclusions are hoped to be helpful for the understanding of ZnO/Si properties under thermal load and to guide the design of delated devices in energy field.