Abstract
The eutectic Sn–Ag–Cu solder is the most popular lead free solder. But reliability and cost issues limit its application. On the other hand, Sn–Ag–Zn system has many advantages comparing with Sn–Ag–Cu. In this paper, interfaces of Sn–xAg–1Zn/Cu and Sn–2Ag–xZn/Cu (x=1, 2, 3), Sn–2Ag–2.5Zn/Cu and Sn–1.5Ag–2Zn/Cu solders joints were studied to understand effects of Ag and Zn contents. Results show that shearing strength of as-reflowed Sn–2Ag–2Zn/Cu and Sn–1.5Ag–2Zn/Cu joints is higher than other joints. Because of the strong Cu–Sn reaction and the formation of Ag3Sn, the Sn–Ag–Zn series solder joints are not suitable for use above 150°C temperature. After 250°C soldering for 4h, while the Zn content increased from 1wt% to 2wt%, the interfacial IMC of Sn–Ag–Zn/Cu altered from Cu6Sn5 to Cu5Zn8. The Cu5Zn8 interface has higher shearing strength than Cu6Sn5 interface. Relationships among microstructure, strength and aging condition are discussed.
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