Abstract
The failure mechanism of the oxygen plasma etched ruthenium lines under the constant-current and constant-voltage stress conditions was studied. The ruthenium line has a much longer lifetime than the plasma-etched copper line. The lifetime of the ruthenium line is dependent on the line width. The narrow line has fewer grain boundaries to initiate the failure process, i.e., formation, growth, and merge of voids, than the wide line has. The surface color change during electric stress is a useful reference for the line broken phenomena. Ruthenium is a promising interconnect material for its high resistance to the electric stress.
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