Study on hot processing map with ANN modification and DRX behaviors of a novel Mg-Ga-Sn anode for an air battery

Abstract

The hot deformation behavior of Mg-Ga-Sn alloys at 360–450 °C and 0.001–1 s−1 was systematically studied by using a thermal simulator. The flow stress is affected by temperature and strain rate, which basically accords with hyperbolic sine constitutive equations. Based on the experimental data, the prediction accuracy of the stress correction model and the artificial neural network (ANN) model was comprehensively compared for the alloy system. The ANN model has good prediction accuracy and a certain degree of extrapolation and generalization ability. By observing the microstructures, the hot processing maps of the ANN modified model were ultimately determined to be closer to the real situation, and the hot processing maps were partially expanded (450–480 °C, 1-2 s−1). Based on the hot processing maps, the suitable processing range (360–450 °C, 0.001–0.01 s−1; 390–420 °C, 0.4–1 s−1) was determined, and a possible processing range (450–480 °C, 0.001–2 s−1; 390–450 °C, 1-2 s−1) was predicted. The EBSD results revealed two typical dynamic recrystallization mechanisms (CDRX and DDRX) in the alloy, corresponding to a strong <0001>//CD texture. In the region of higher temperature and lower strain rate, an obvious bimodal texture is found in the alloy, which is related to the promotion of nonbasal slip by Ga.