Abstract
In this paper, nominal composition of Cu-0.3Cr-0.07Ag (at%) was designed. The high temperature properties and microstructure were investigated by Transmission electron microscopy (TEM) and scanning electron microscopy (SEM). The results show that the tensile strength of CuCrAg decreases as temperature rises, which was associated with the coarsen precipitates according to TEM observation. Furthermore, observations of fracture morphology reveal that the mechanism transforms into brittle fracture from ductile fracture at elevated temperature. Creep curves were found to vary as a function of applied stress and temperature, the stress exponent values are 8.7, 4.6, 4.3 at 673K, 773K, 873K respectively. The mechanism is dislocation climbing at 773K and 873K while creep behavior at 673K could be explained by the invariant substructure model.
Sign-in/Register to access full text options 
Free) 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a call
