Abstract
ABSTRACTExtended defects formed by antimony ion implantation in Si(100) was investigated as a function of the implant energy. The implanted layer was examined by cross-sectional electron microscopy (TEM). Post-implantation spike-annealing was also performed from 950°C to 1095°C to examine evolution of defects. From the TEM study, the threshold energy to induce visible defects for Sb implantation was found to be more than 50 keV. A mapping for the location of defects was constructed by TEM and secondary ion mass spectroscopy (SIMS). The end-of-range (EOR) defects, which were possibly formed during the solid phase epitaixy regrowth, were located near the lower bound of the transition region. For 70-keV implantation, extended defects appear at the near-surface and the EOR region. It was observed that the near-surface defects diminished after annealing at more than 1050°C, while the EOR defects became coarsening at 1095°C.
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