Abstract
Silicon material is a widely used substrate in micro-electromechanical systems, and its micro-fabrication technology has always been a research hotspot. The main microfabrication methods of silicon material are chemical etching, electrochemical machining (ECM) and electrical discharge machining (EDM). The electrochemical and electrical discharge compound machining technology is a kind of machining method for non-conductive materials. In this paper, the compound machining technology was studied and applied to the microfabrication of silicon material. The machining principle of silicon material in hydrochloric acid solution was studied, and the influence of silicon material type and voltage on the machining was analyzed. It is found that n-type silicon can be machined, while p-type silicon can hardly be machined. With this technology, micro three-dimensional structures can be fabricated on silicon material.
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