Abstract
In this work, octa(3-aminopropyl)polyhedral oligomeric silsesquioxane (Oap-POSS) [(NH2CH2CH2CH2)8Si8O12] was synthesized through hydrolytic condensation of (3-aminopropyl)triethoxysilane, and incorporated into epoxy resin (EP) cured with methyl hexahydrophthalic anhydride (MHHPA) to offer a series of novel POSS/EP nanocomposites. The microstructure, thermal stabilities, electric insulation and dielectric behaviors of the epoxy nanocomposites were studied. The results showed that the thermal stability and dielectric property of the POSS/EP increases with the incorporation of Oap-POSS into EP.
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