Study on Degradation of SF6 in the Presence of H2O and O2 Using Dielectric Barrier Discharge

Xiaoxing Zhang,Yi Li,Hanyan Xiao,Ju Tang,Zhaolun Cui,Yalong Li

doi:10.1109/access.2018.2879157

Xiaoxing Zhang, Yi Li + Show 4 more

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https://doi.org/10.1109/access.2018.2879157

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Abstract

In this paper, a method using dielectric barrier discharge for SF 6 abatement is investigated. The destruction and removal efficiencies (DRE) of plasma abatement of 2% SF 6 in the presence of H 2 O and O 2 were studied. The addition of H 2 O and O 2 effectively promoted the decomposition process of the SF 6 . With the participation of 0.5% H 2 O and 2% O 2 , the DRE reached 98.2% at 50mL/min flow rate and the energy efficiency reached 5.73 g/kWh. By emission spectra and products composition analysis, we found that the addition of H 2 O can generate a large amount of H and OH radicals in plasma region, making SF 6 tend to degrade to produce SO 2 . The addition of O 2 can generate a large amount of O radicals, which promotes the production of SO 2 F 2 . The addition gas not only affects the type of products, but also determines the selectivity of each degradation product. The results in this paper provide experimental support for the treatment of SF 6 tail gas using low temperature plasma.

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