Abstract
In order to study the effects of numerous variables affecting the reaction rate of heat-resistant flexible modified epoxy resin adhesive, the curing kinetics of polyamide modified epoxy resin was studied. The heat- resistant flexible modified epoxy resin adhesive cured at room-temperature was prepared with epoxy resin, polysulfide rubber and organosilicone as adhesive component, polyamide as main curing agent and addition of different modified filler and the curing agent containing benzene ring structure. The curing kinetics of polyamide modified epoxy resin was studied by Differential Scanning Calorimetry (DSC) at different heating speeds and the characteristic temperatures of the curing process were analyzed and confirmed. the kinetics parameters of activation energy was calculated using Flynn-Wall-Ozawa equation and Kissinger equation, respectively, then the kinetic model of curing reaction was built as �������� = 4.38×10 7 exp (-57740/RT) (1-α) 0.93 , the results show that the two- parameter model is adequate to represent the curing reaction process, the model can well describe the curing reaction process of the studied resin. The DSC curves obtained using the experimental data show a good agreement with that theoretically calculated. The research results will provide theoretical basis for the choice of manufacturing process and the optimization of processing window.
Highlights
Epoxy resins are widely used in diverse areas such as molding compounds, surface coating and painting materials, microelectronic encapsulated materials, printed circuit boards and adhesives owing to their satisfactory mechanical properties, including suitable weather, chemical and thermal resistance (Horie et al, 1970; Acitelli et al, 1971)
The curing kinetics of polyamide modified epoxy resin was studied by Differential Scanning Calorimetry (DSC) at different heating speeds and the characteristic temperatures of the curing process were analyzed when the heating speed is zero
Reagents and instruments: Epoxy Resin E51, E20 (Hangzhou Wuhuigang Adhesive Co., Ltd., China), polysulfide rubber 121 (Tianjin Kailis Chemical Co., Ltd., China), organosilicone FJN-9802 (Changzhou Jianuo Organicsilicon Co., Ltd., China), DMP-30 (Sinopharm Chemical Reagent Co., Ltd., China), mphenylenediamine (Sinopharm Chemical Reagent Co., Ltd., China), KH-560 (Shanghai Zhongyi Plastic Products Factory, China), polyamide 650 (Hangzhou Wuhuigang Adhesive Co., Ltd., China), accelerator of polyetherimide TKM-3908 (Qingdao Runbang Chemical Industry Co., Ltd., China); dibutyl phthalate (Sinopharm Chemical Reagent Co., Ltd., China), organotin (Sinopharm Chemical Reagent Co., Ltd., China), basic magnesium carbonate (Sinopharm Chemical Reagent Co., Ltd., China), mica powder (Sinopharm Chemical Reagent Co., Ltd., China), acetone and ethanol were of AR grade, obtained from Shanghai Chemical Reagent Co., Ltd. with purities of 0.995 in mass fractions
Summary
Epoxy resins are widely used in diverse areas such as molding compounds, surface coating and painting materials, microelectronic encapsulated materials, printed circuit boards and adhesives owing to their satisfactory mechanical properties, including suitable weather, chemical and thermal resistance (Horie et al, 1970; Acitelli et al, 1971). The glass transition temperature, weigh loss temperature and char yield of cured system, the curing rates and activation energy are important kinetic parameters in the curing reaction process. Study on the curing kinetics of modified epoxy resin have both practical and theoretical value (Horie et al, 1970; Acitelli et al, 1971; Zhao et al, 2006; Niu et al, 2008). The kinetics parameters of activation energy was calculated using Flynn-Wall-Ozawa equation and Kissinger equation respectively, the kinetic model of curing reaction was built (Xia et al, 2010; Wang et al, 2011). The research results will provide theoretical basis for the choice of manufacturing process and the optimization of processing window
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