Abstract
The curing kinetics of the hexahydro-4-methylphthalic anhydride (MHHPA)/diglycidyl 1,2-cyclohexane dicarboxylate (CY184) epoxy resin system and MHHPA/CY184 epoxy/episulfide resin system (containing 2 mass% DMP-30 as an accelerator) was comparatively investigated by non-isothermal differential scanning calorimetry with a model-fitting Malek method and a model-free advanced isoconversional method of Vyazovkin, and the curing behavior was discussed based on the proposed curing mechanism. The results indicated that both of the MHHPA/CY184 epoxy resin system and MHHPA/CY184 epoxy/episulfide resin system fitted Sestak–Berggren model. The activation energy of MHHPA/CY184 epoxy/episulfide resin system was lower than that of MHHPA/CY184 epoxy resin system, suggesting that the episulfide resin has higher reactivity and can accelerate the reaction. The value of m in the kinetic model equation in MHHPA/CY184 epoxy/episulfide resin system is much smaller than that in MHHPA/CY184 epoxy resin system, indicating, unlike the MHHPA/CY184 epoxy resin system, MHHPA/CY184 epoxy/episulfide resin system has much less autocatalytic effect.
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