Abstract
In order to improving reliability and economy of down-lead bonding of MEMS packaging , NiPdAu PCB is leaded in ,because palladium is joined in protecting involucra , bonding technology parameter must change . In this paper , robust parameter design method of DOE is used and optimize bonding technology parameter of new type NiPdAu involucra has been discovered , according to optimize results , mending bonding technology parameter and Ni Pd Au PCB is triumphantly used into MEMS packaging technology , not only increasing reliability of products , but also reducing cost of raw materials and obtaining well economy benefit.
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