Abstract
SUMMARYA study has been made of the mechanism of hypophosphite-reduced acidic electroless nickel (EN) plating. The influences of temperature, pH value, reagents of pH, complex reagents and stabilizer etc. have been studied. Lactic acid and malic acid are selected as complexing reagents. KIO3, HAc and ammonia are selected as stabilizer, buffer and pH regulator respectively. A new medium speed, long life-span and useful EN plating process has been developed.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
