Abstract
Self-aligned assembly (SAA) based on liquid capillary force was investigated for die to die (D2D) and die to wafer (D2W) applications. Two kinds of chips with etched edges and self-assembled monolayer (SAM) respectively, named etched chip and SAM chip, were used for D2D SAA. The etched chip and wafer with etched slot were used for D2W SAA. For D2D SAA, the top chips were driven by the liquid capillary force to be self-aligned at room temperature with high accuracies. For D2W SAA, the methodology should be improved further. The surface cleanliness and dropping method of chips had important impact on the alignment accuracy.
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