Study on 100 Gbit/inch2 Density Molding Using Double-Sided Heat Insulated Mold

Abstract

Previously we showed substrates without any pit deformation in the case of injection molding a 40 Gbit/inch2 read only memory (ROM) substrate using the single-sided heat insulated mold, in which a heat insulating plate was located below a stamper, and the slow mold opening method. This type of mold is characterized by the fact that pits on the substrates can be replicated at a low mold temperature, to avoid the twisting of substrates. However, it was found that the radial tilt was large. Therefore, we investigated this phenomenon using simulations, and fabricated a double-sided heat insulated mold with a symmetric structure in the thickness direction of the substrates. We showed that performing injection molding using this double-sided mold rendered the radial tilt of substrates controllable, so that it was possible to obtain flat disks. Furthermore, we obtained a 120-mm-diameter 100 Gbit/inch2 ROM substrate, which had no pit deformation over the entire pit area even though the pit wall angle was greater than 80 deg. This density corresponds to approximately 140 Gbyte.