Abstract
The aim of this research is to characterize the soldering alloy Zn6Al6Ag, and to study the ultrasonic soldering of an Al2O3/metal–ceramic composite (Al/Al2O3). Zn6Al6Ag solder presents a quasi-eutectic structure with a melting point around 425 °C. The solder microstructure consists of a (Zn) + (Al) matrix, reinforced with a silver AgZn3 phase. A bond with the metal–ceramic composite was formed due to the dissolution of Al in the liquid Zn solder. The Al2O3 particles were put into motion, and a new composite was formed on the boundary. The Zn6Al6Ag solder also wetted the surface of the Al2O3 ceramic. A decisive effect on bond formation was caused by zinc and aluminum, whose oxides were combined with the oxides of ceramic material during in-air soldering. An adhesive bond was formed. The average joint shear strength of Al2O3/metal–ceramic composite (Al/Al2O3) was found to be 23 MPa.
Highlights
Demand is growing for thermally controlled materials in microelectronics
Because the specific thermal conductivity (TC) (TC divided by density) of a solid solution (Al)-based composites is high, they are desirable for applications, such as in the aviation industry, where low mass is desirable [1,2]
The differential scanning calorimetry (DSC)/DTA (Differential thermal analysis) analysis was performed on two specimens of Metals 2020, 10, x FOR PEER REVIEW
Summary
Demand is growing for thermally controlled materials in microelectronics. Semiconductors stimulated the development of sophisticated metal–ceramic composites (MMC) with high thermal conductivity (TC) for efficient heat dissipation, and adjustable coefficient of thermal expansivity (CTE)to minimize thermal stresses. Demand is growing for thermally controlled materials in microelectronics. Semiconductors stimulated the development of sophisticated metal–ceramic composites (MMC) with high thermal conductivity (TC) for efficient heat dissipation, and adjustable coefficient of thermal expansivity (CTE). This is of principal significance for enhancing the power efficiency, life cycle, and reliability of electronic equipment. Because the specific TC (TC divided by density) of Al-based composites is high, they are desirable for applications, such as in the aviation industry, where low mass is desirable [1,2]. Materials used for packaging underwent immense development, owing to many key factors: an increase in the density of packages, greater demand for reliability, growing use of large semiconductor materials with phase arrays, and strict weight limitations for onboard components and many other systems [3].
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