Abstract
Abstract The silver nanoparticle paste is a promising material for high temperature die-attach applications. In this paper, the finite element method is used to study the relationship between the thickness of the sintered silver layer and the thermal stress in the sintered silver joint. Silicon chips are bonded together with sintered silver layers of different thicknesses. In the experimental study, strain gauges are attached onto the surface of the upper silicon and used to estimate the effects of the nano silver die-attach layer. The results show that the average stress in the silver layer at the interface decreases with the increasing thickness of the silver layer, while the stress on the silicon surface increases with the increasing thickness of the silver layer.
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More From: Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)
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