Study of thermal deformation of microelectronics packaging product by interferometric technique

Abstract

In this paper, the out-of-plane deformation of silicon surface of Direct Chip Attachment (DCA) assembly, under thermal loading, was measured in real-time by Twyman/Green interferometry. The contour maps of the out-of-plane displacement fields of silicon surface under thermal loading and cycling of various temperature were obtained. Experimental results show that the relation between the out-of-plane displacement and temperature is nonlinear and varies with temperature cycling, due to nonlinear mechanical behavior of the materials used in electronic packaging. A comparison of the out-of-plane displacement fields of silicon surface measured by T/G interferometry in real-time and replicating technique of high temperature specimen grating of moire interferometry was made.