Abstract
The reaction mechanism of metal-containing and complex compound with epoxy oligomer of diglycidyl ether of bisphenol A (DGEBA) was studied using dynamic DSC technique. It is shown that cure reaction of the epoxy oligomers with copper acetate proceeds at two stages: through coordination of cation with the epoxy group, and through ionic polymerization at high temperatures. Mechanism of curing of DGEBA with copper chelate depends on equilibrium process of dissociation of the chelate which, in turn, depends not only on temperature of curing but also on concentration of the hardener. At the dissociation temperature of the hardener, polymerization proceeds according to ionic mechanism. Hardening of the epoxy oligomers due to interaction of epoxy groups with unconnected amine groups predominate at higher temperatures or at higher concentrations of the hardener. At low temperatures and small concentrations of the hardener, polymerization proceeds according to catalytic ionic mechanism.
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