Abstract
The mobility of individual triple junctions in aluminum is studied. Triple junctions with 〈111〉, 〈100〉, and 〈110〉 tilt boundaries are studied. The data obtained show that, at low temperatures, the mobility of the system of grain boundaries with a triple junction is controlled by the mobility of the triple junction (the junction kinetics). At high temperatures, the system mobility is determined by the mobility of the grain boundaries (the boundary kinetics). There is a temperature at which the transition from the junction kinetics to the boundary kinetics occurs; this temperature is determined by the crystallographic parameters of the sample.
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