Abstract
The contributions of grain boundary sliding and intragranular dislocation slip in the AMg4 alloy (analog AA5083) during superplastic deformation have been analyzed by analyzing the deformation-induced changes in the sample surface having marker grids patterned by ion beam etching. Optical, electron transmission, and scanning microscopy techniques, and electron backscatter diffraction were used to analyze the changes in dislocation, grain, and subgrain structures during superplastic deformation. It has been shown that dynamic polygonization develops during superplastic deformation. The contribution of diffusion creep is defined from the analysis of precipitation-free zones observed after deformation.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
