Study Of The Mechanical Properties Of A Cu/CF Composite With Zrc Interphase

Abstract

Electronic devices present a large coefficient of thermal expansion (CTE) mismatch between the copper thermal drain and the ceramic and silicon parts. This CTE mismatch causes thermomechanical stresses at the component interfaces (solder joint) resulting in component and/or solder joint failure. Copper composites reinforced with carbon fibres are materials of choice to overcome this drawback due to their expected adaptive CTE. To ensure good transfer of properties, chemical bonding between the matrix and reinforcement is necessary. The challenge of this work is to synthesize these composites, by hot uniaxial pressing, and to produce in-situ Zr-based interphase during the densification step. The microstructure and the chemistry of the matrix and of the interfacial zones, will be finely characterized by optical, scanning and transmission electronic microscopy.